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2024 Crack & Chip Sealing Program

Sector: Government • Location: Darien, Wisconsin, United States of America

Source: Dodge USA

Project
Closed

For this project, the Village of Darien will ONLY be receiving and accepting bids for the 2024 Crack & Chip Sealing Program via the online electronic bid service through QuestCDN.com. Electronic bids will be accepted until 2:00 P.M., Thursday, April 4, 2024. After the official Bid closing time, Bids will be opened, reviewed and, if accepted, displayed. To access the electronic bid form, download t

Status
Closed
Sector
Government, Commercial, Manufacturing (Industrial)
Location
Darien, Wisconsin, United States of America
Updated
22 Jul 2026
Source
Dodge USA

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Project Information

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The project “2024 Crack & Chip Sealing Program” is an infrastructure initiative in the Government sector, located in Darien, Wisconsin, United States of America. Taiyo aggregates data on it from Dodge USA.

Participants

Not available for this record.

Status

Original status

closed

Taiyo status

Closed

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

For this project, the Village of Darien will ONLY be receiving and accepting bids for the 2024 Crack & Chip Sealing Program via the online electronic bid service through QuestCDN.com. Electronic bids will be accepted until 2:00 P.M., Thursday, April 4, 2024. After the official Bid closing time, Bids will be opened, reviewed and, if accepted, displayed. To access the electronic bid form, download the project documents and click the online bidding button at the top of advertisement. The electro...

Procurement method

Budget

Location

Country

United States of America (USA)

State

Wisconsin

City

Darien

Source

Source

Dodge USA

URL

More Details

Record type

Project

Sector

Government, Commercial, Manufacturing (Industrial)

Article published date

2024-04-01

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