What is the latest status of the project “3D Glass Chip Packaging Unit in Odisha”?

The status recorded for “3D Glass Chip Packaging Unit in Odisha” is under construction.

What is the budget and commercial profile for the project “3D Glass Chip Packaging Unit in Odisha”?

Taiyo normalizes the budget of “3D Glass Chip Packaging Unit in Odisha” to USD 236392820.

Where can I verify the source and access all details for “3D Glass Chip Packaging Unit in Odisha”?

This Taiyo project page references The Indian Express along with the original URL (https://indianexpress.com/article/explained/explained-economics/india-3d-chip-packaging-unit-odisha-10646100/). Taiyo standardizes official data into a consistent, searchable project profile.

3D Glass Chip Packaging Unit in Odisha

Sector: Advanced Electronics • Location: Bhubaneswar, Odisha, India

Source: The Indian Express

Project

Under Construction

The project involves the construction of India's first advanced 3D glass chip packaging unit in Bhubaneswar, Odisha. It will produce glass substrate panels and advanced 3D heterogeneous integration (3DHI) modules with applications in AI, 5G, defence, and data centres. The project is led by US-based 3D Glass Solutions and has received investments from Intel, Lockheed Martin, and other VC and PE fun

Status: Under Construction
Sector: Advanced Electronics, Manufacturing (Industrial)
Location: Bhubaneswar, Odisha, India
Updated: 22 Jul 2026
Source: The Indian Express

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Project Information

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The project “3D Glass Chip Packaging Unit in Odisha” is an infrastructure initiative in the Advanced Electronics sector, located in Bhubaneswar, Odisha, India. Taiyo aggregates data on it from The Indian Express.

Participants

Not available for this record.

Status

Original status	under construction
Taiyo status	Under Construction
Taiyo last update	2026-07-22

Contact

Not available for this record.

Description

Description	The project involves the construction of India's first advanced 3D glass chip packaging unit in Bhubaneswar, Odisha. It will produce glass substrate panels and advanced 3D heterogeneous integration (3DHI) modules with applications in AI, 5G, defence, and data centres. The project is led by US-based 3D Glass Solutions and has received investments from Intel, Lockheed Martin, and other VC and PE funds. It is part of the India Semiconductor Mission, which aims to build a full-stack chip ecosystem.
Original sector	Technology
Budget

Location

Country	India
State	Odisha
City	Bhubaneswar

Source

Source	The Indian Express
URL

More Details

Record type	Project
Sector	Advanced Electronics, Manufacturing (Industrial)
Article published date	2026-04-24

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3D Glass Chip Packaging Unit in Odisha

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