3D Glass Semiconductor Packaging Unit in Odisha
Sector: Manufacturing (Industrial) • Location: Bhubaneswar, Odisha, India
Source: The Times of India
3D Glass Solutions Inc, a US-headquartered company, will set up a semiconductor packaging unit in Bhubaneswar's Info Valley, Odisha. The facility will manufacture glass interposers, silicon bridges, and 3D heterogeneous integration modules with planned capacities of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually. It will cater to defence, high-performan
- Status
- Prospective
- Sector
- Manufacturing (Industrial), Automotive, Advanced Electronics, Government
- Location
- Bhubaneswar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- The Times of India
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Project Information
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Sponsoring Agency |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | 3D Glass Solutions Inc, a US-headquartered company, will set up a semiconductor packaging unit in Bhubaneswar's Info Valley, Odisha. The facility will manufacture glass interposers, silicon bridges, and 3D heterogeneous integration modules with planned capacities of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually. It will cater to defence, high-performance computing, AI, RF, automotive electronics, photonics, and co-packaged optics sectors. |
Original sector | Manufacturing |
Budget |
Location
Country | India |
State | Odisha |
City | Bhubaneswar |
Source
Source | The Times of India |
URL |
More Details
Record type | Project |
Sector | Manufacturing (Industrial), Automotive, Advanced Electronics, Government |
Article published date | 2025-09-16 |
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