Question 1

What are the key details for the project “3D Glass Semiconductor Packaging Unit in Odisha”?

Accepted Answer

The project “3D Glass Semiconductor Packaging Unit in Odisha” is an infrastructure initiative in the Advanced Electronics sector, located in Bhubaneswar, Odisha, India. Taiyo aggregates data on it from The Times of India.

Question 2

What is the latest status of the project “3D Glass Semiconductor Packaging Unit in Odisha”?

Accepted Answer

The status recorded for “3D Glass Semiconductor Packaging Unit in Odisha” is planned.

Question 3

Who are the main government, EPC, and private stakeholders for “3D Glass Semiconductor Packaging Unit in Odisha”?

Accepted Answer

Taiyo maps the stakeholders of “3D Glass Semiconductor Packaging Unit in Odisha”: government bodies (Union Cabinet of India).

Question 4

What is the budget and commercial profile for the project “3D Glass Semiconductor Packaging Unit in Odisha”?

Accepted Answer

Taiyo normalizes the budget of “3D Glass Semiconductor Packaging Unit in Odisha” to USD 490020070.

Question 5

Where can I verify the source and access all details for “3D Glass Semiconductor Packaging Unit in Odisha”?

Accepted Answer

This Taiyo project page references The Times of India along with the original URL (https://timesofindia.indiatimes.com/city/bhubaneswar/union-cabinet-approves-2-semiconductor-projects-worth-rs-4009cr-for-odisha/articleshow/123265153.cms). Taiyo standardizes official data into a consistent, searchable project profile.

Original status	planned
Taiyo status	Prospective
Taiyo last update	2026-07-22

Description	3D Glass Solutions Inc (3DGS), a US-headquartered company, will set up a semiconductor packaging unit in Bhubaneswar's Info Valley, Odisha. The facility will manufacture glass interposers, silicon bridges, and 3D heterogeneous integration modules with capacities of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually, targeting defence, AI, automotive electronics, and photonics sectors.
Original sector	Manufacturing
Budget

Record type	Project
Sector	Advanced Electronics, Automotive, Manufacturing (Industrial), Government
Article published date	2025-08-14

3D Glass Semiconductor Packaging Unit in Odisha

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Country	India
State	Odisha
City	Bhubaneswar

3D Glass Semiconductor Packaging Unit in Odisha

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