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3D Glass Solutions advanced 3D chip packaging unit

Sector: Advanced Electronics • Location: Odisha, India

Source: The Indian Express

Project
Planned

India's first advanced 3D chip packaging unit being implemented by US-based 3D Glass Solutions Inc through its wholly owned Indian subsidiary Heterogeneous Integration Packaging Solutions Pvt Ltd. Funded by Intel and others.

Status
Prospective
Sector
Advanced Electronics, Manufacturing (Industrial)
Location
Odisha, India
Updated
22 Jul 2026
Source
The Indian Express

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Project Information

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The project “3D Glass Solutions advanced 3D chip packaging unit” is an infrastructure initiative in the Advanced Electronics sector, located in Odisha, India. Taiyo aggregates data on it from The Indian Express.

Participants

Not available for this record.

Status

Original status

planned

Taiyo status

Prospective

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

India's first advanced 3D chip packaging unit being implemented by US-based 3D Glass Solutions Inc through its wholly owned Indian subsidiary Heterogeneous Integration Packaging Solutions Pvt Ltd. Funded by Intel and others.

Original sector

Semiconductor Manufacturing

Location

Country

India

State

Odisha

Source

Source

The Indian Express

URL

More Details

Record type

Project

Sector

Advanced Electronics, Manufacturing (Industrial)

Article published date

2026-05-08

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