Question 1

What are the key details for the project “3D Glass Solutions Advanced Packaging and Embedded Glass Substrate Unit”?

Accepted Answer

The project “3D Glass Solutions Advanced Packaging and Embedded Glass Substrate Unit” is an infrastructure initiative in the Advanced Electronics sector, located in Bhubaneshwar, Odisha, India. Taiyo aggregates data on it from The Times of India.

Question 2

What is the latest status of the project “3D Glass Solutions Advanced Packaging and Embedded Glass Substrate Unit”?

Accepted Answer

The status recorded for “3D Glass Solutions Advanced Packaging and Embedded Glass Substrate Unit” is planned.

Question 3

Who are the main government, EPC, and private stakeholders for “3D Glass Solutions Advanced Packaging and Embedded Glass Substrate Unit”?

Accepted Answer

Taiyo maps the stakeholders of “3D Glass Solutions Advanced Packaging and Embedded Glass Substrate Unit”: government bodies (India).

Question 4

What is the budget and commercial profile for the project “3D Glass Solutions Advanced Packaging and Embedded Glass Substrate Unit”?

Accepted Answer

Taiyo normalizes the budget of “3D Glass Solutions Advanced Packaging and Embedded Glass Substrate Unit” to USD 562258000.

Question 5

Where can I verify the source and access all details for “3D Glass Solutions Advanced Packaging and Embedded Glass Substrate Unit”?

Accepted Answer

This Taiyo project page references The Times of India along with the original URL (https://timesofindia.indiatimes.com/business/india-business/big-make-in-india-push-cabinet-approves-four-new-semiconductor-projects-cumulative-investment-of-around-rs-4600-crore-eyed-check-details/articleshow/123256391.cms). Taiyo standardizes official data into a consistent, searchable project profile.

Original status	planned
Taiyo status	Prospective
Taiyo last update	2026-07-22

Description	3D Glass Solutions Inc. is developing an advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This facility will introduce cutting-edge packaging technology to India, enhancing semiconductor industry efficiency. The unit will incorporate glass interposers with passives and silicon bridges, alongside 3D Heterogeneous Integration modules. Annual production targets include 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules, serving defence, high-performance computing, AI, RF and automotive, photonics, and co-packaged optics applications.
Original sector	Semiconductor
Budget

Record type	Project
Sector	Advanced Electronics, Automotive, Government
Article published date	2025-08-14

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Country	India
State	Odisha
City	Bhubaneshwar

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