3D Glass Solutions Advanced Packaging and Embedded Glass Substrate Unit
Sector: Government • Location: Bhubaneswar, Odisha, India
Source: The New Indian Express
3D Glass Solutions (3DGS) Inc will establish an integrated advanced packaging and embedded glass substrate unit at the electronic system design and manufacturing (ESDM) park at Info Valley-II on the outskirts of Bhubaneswar, Odisha. The unit will bring advanced packaging technologies including glass interposers with passives, silicon bridges, and 3D heterogeneous integration modules, with a capaci
- Status
- Prospective
- Sector
- Government, Advanced Electronics, Automotive, Manufacturing (Industrial)
- Location
- Bhubaneswar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- The New Indian Express
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Project Information
Participants
Sponsoring Agency |
Status
Original status | approved |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | 3D Glass Solutions (3DGS) Inc will establish an integrated advanced packaging and embedded glass substrate unit at the electronic system design and manufacturing (ESDM) park at Info Valley-II on the outskirts of Bhubaneswar, Odisha. The unit will bring advanced packaging technologies including glass interposers with passives, silicon bridges, and 3D heterogeneous integration modules, with a capacity of around 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The products will have applications in defence, high-performance computing, AI, radio frequency, automotive, photonics, and co-packaged optics. |
Original sector | Semiconductor Manufacturing |
Budget |
Location
Country | India |
State | Odisha |
City | Bhubaneswar |
Source
Source | The New Indian Express |
URL |
More Details
Record type | Project |
Sector | Government, Advanced Electronics, Automotive, Manufacturing (Industrial) |
Article published date | 2025-08-14 |
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