3D Glass Solutions Advanced Packaging Facility
Sector: Manufacturing (Industrial) • Location: Bhubaneswar, Odisha, India
Source: Moneycontrol
3D Glass Solutions Inc. (3DGS) will establish an advanced packaging and embedded glass substrate facility in Odisha's Info Valley, Bhubaneswar. The facility will introduce the world's most advanced semiconductor packaging technology to India, with an annual capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3D Heterogeneous Integration modules. The technology will be
- Status
- Prospective
- Sector
- Manufacturing (Industrial), Advanced Electronics
- Location
- Bhubaneswar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- Moneycontrol
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Project Information
Participants
| Not available for this record. |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | 3D Glass Solutions Inc. (3DGS) will establish an advanced packaging and embedded glass substrate facility in Odisha's Info Valley, Bhubaneswar. The facility will introduce the world's most advanced semiconductor packaging technology to India, with an annual capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3D Heterogeneous Integration modules. The technology will be used in high-performance computing, AI, defence electronics, radio frequency, and photonics applications. |
Original sector | Electronics Manufacturing |
Location
Country | India |
State | Odisha |
City | Bhubaneswar |
Source
Source | Moneycontrol |
URL |
More Details
Record type | Project |
Sector | Manufacturing (Industrial), Advanced Electronics |
Article published date | 2025-09-16 |
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