3D Glass Solutions Advanced Packaging Facility
Sector: Manufacturing (Industrial) • Location: Bhubaneswar, Odisha, India
Source: Awaz The Voice
3D Glass Solutions Inc. (3DGS) will establish an advanced packaging and embedded glass substrate facility in Odisha's Info Valley, Bhubaneswar. It will introduce the world's most advanced semiconductor packaging technology to India, with an annual capacity of 69,600 glass panel substrates, 50 million assembled units and 13,200 3D Heterogeneous Integration modules.
- Status
- Prospective
- Sector
- Manufacturing (Industrial), Advanced Electronics, Government
- Location
- Bhubaneswar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- Awaz The Voice
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Project Information
Participants
Sponsoring Agency |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | 3D Glass Solutions Inc. (3DGS) will establish an advanced packaging and embedded glass substrate facility in Odisha's Info Valley, Bhubaneswar. It will introduce the world's most advanced semiconductor packaging technology to India, with an annual capacity of 69,600 glass panel substrates, 50 million assembled units and 13,200 3D Heterogeneous Integration modules. |
Original sector | Semiconductor Manufacturing |
Budget |
Location
Country | India |
State | Odisha |
City | Bhubaneswar |
Source
Source | Awaz The Voice |
URL |
More Details
Record type | Project |
Sector | Manufacturing (Industrial), Advanced Electronics, Government |
Article published date | 2025-09-16 |
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