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3D Glass Solutions Advanced Packaging Facility

Sector: Advanced Electronics • Location: Bhubaneswar, Odisha, India

Source: Awaz The Voice

Project
Approved

3D Glass Solutions Inc. (3DGS) will establish an advanced packaging and embedded glass substrate facility in Odisha's Info Valley, Bhubaneswar. It will introduce the world's most advanced semiconductor packaging technology to India, with an annual capacity of 69,600 glass panel substrates, 50 million assembled units and 13,200 3D Heterogeneous Integration modules.

Status
Prospective
Sector
Advanced Electronics, Manufacturing (Industrial), Government
Location
Bhubaneswar, Odisha, India
Updated
22 Jul 2026
Source
Awaz The Voice

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Project Information

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The project “3D Glass Solutions Advanced Packaging Facility” is an infrastructure initiative in the Advanced Electronics sector, located in Bhubaneswar, Odisha, India. Taiyo aggregates data on it from Awaz The Voice.

Participants

Sponsoring Agency

Status

Original status

approved

Taiyo status

Prospective

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

3D Glass Solutions Inc. (3DGS) will establish an advanced packaging and embedded glass substrate facility in Odisha's Info Valley, Bhubaneswar. It will introduce the world's most advanced semiconductor packaging technology to India, with an annual capacity of 69,600 glass panel substrates, 50 million assembled units and 13,200 3D Heterogeneous Integration modules.

Original sector

Semiconductor Manufacturing

Budget

Location

Country

India

State

Odisha

City

Bhubaneswar

Source

Source

Awaz The Voice

URL

More Details

Record type

Project

Sector

Advanced Electronics, Manufacturing (Industrial), Government

Article published date

2025-08-14

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