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3D Glass Solutions Advanced Packaging Hub in Odisha

Sector: Advanced Electronics • Location: Bhubaneswar, Odisha, India

Source: Khabar India

Project
Planned

3D Glass Solutions Inc. will set up a vertically integrated advanced packaging and embedded glass substrate facility in Info Valley, Bhubaneswar, Odisha. This facility will bring cutting-edge semiconductor packaging technology to India, including glass interposers with passives, silicon bridges, and 3D Heterogeneous Integration modules, with an annual capacity of 69,600 glass panel substrates, 50

Status
Prospective
Sector
Advanced Electronics, Automotive, Manufacturing (Industrial)
Location
Bhubaneswar, Odisha, India
Updated
22 Jul 2026
Source
Khabar India

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Project Information

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The project “3D Glass Solutions Advanced Packaging Hub in Odisha” is an infrastructure initiative in the Advanced Electronics sector, located in Bhubaneswar, Odisha, India. Taiyo aggregates data on it from Khabar India.

Participants

Not available for this record.

Status

Original status

planned

Taiyo status

Prospective

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

3D Glass Solutions Inc. will set up a vertically integrated advanced packaging and embedded glass substrate facility in Info Valley, Bhubaneswar, Odisha. This facility will bring cutting-edge semiconductor packaging technology to India, including glass interposers with passives, silicon bridges, and 3D Heterogeneous Integration modules, with an annual capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules. Applications include defence, AI, high-performance computing, RF, automotive, photonics, and optical communication.

Original sector

Semiconductor Manufacturing

Location

Country

India

State

Odisha

City

Bhubaneswar

Source

Source

Khabar India

URL

More Details

Record type

Project

Sector

Advanced Electronics, Automotive, Manufacturing (Industrial)

Article published date

2025-08-14

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