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3D Glass Solutions Advanced Packaging Project

Sector: Advanced Electronics • Location: Odisha, India

Source: The Economic Times

Project
Early Execution Phase

3D Glass Solutions is executing an advanced packaging project in Odisha focusing on RF, SiP, glass interposers, and heterogeneous integration. The project is in the early execution phase.

Status
Under Construction
Sector
Advanced Electronics, Manufacturing (Industrial)
Location
Odisha, India
Updated
22 Jul 2026
Source
The Economic Times

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Project Information

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The project “3D Glass Solutions Advanced Packaging Project” is an infrastructure initiative in the Advanced Electronics sector, located in Odisha, India. Taiyo aggregates data on it from The Economic Times.

Participants

Not available for this record.

Status

Original status

early execution phase

Taiyo status

Under Construction

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

3D Glass Solutions is executing an advanced packaging project in Odisha focusing on RF, SiP, glass interposers, and heterogeneous integration. The project is in the early execution phase.

Original sector

Technology

Location

Country

India

State

Odisha

Source

Source

The Economic Times

URL

More Details

Record type

Project

Sector

Advanced Electronics, Manufacturing (Industrial)

Article published date

2026-03-26

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