3D Glass Solutions Advanced Packaging Unit
Sector: Advanced Electronics • Location: Odisha, India
Source: Ommcom News
3D Glass Solutions Inc. will set up a vertically integrated advanced packaging and embedded glass substrate unit in Odisha. The facility will include advanced technologies such as glass interposers with passives and silicon bridges, and 3D heterogeneous integration modules. The planned capacity is approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per
- Status
- Prospective
- Sector
- Advanced Electronics, Automotive, Manufacturing (Industrial), Government
- Location
- Odisha, India
- Updated
- 22 Jul 2026
- Source
- Ommcom News
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Project Information
Participants
Sponsoring Agency |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | 3D Glass Solutions Inc. will set up a vertically integrated advanced packaging and embedded glass substrate unit in Odisha. The facility will include advanced technologies such as glass interposers with passives and silicon bridges, and 3D heterogeneous integration modules. The planned capacity is approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The products will have applications in defence, high-performance computing, AI, RF and automotive, photonics, and co-packaged optics. |
Original sector | Manufacturing |
Budget |
Location
Country | India |
State | Odisha |
Source
Source | Ommcom News |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Automotive, Manufacturing (Industrial), Government |
Article published date | 2025-08-14 |
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