3D Glass Solutions Inc. Advanced Packaging and Embedded Glass Substrate Facility
Sector: Advanced Electronics • Location: Bhubaneswar, Odisha, India
Source: Big News Network
3D Glass Solutions Inc. will establish an advanced packaging and embedded glass substrate semiconductor facility in Odisha's Info Valley, Bhubaneswar.
- Status
- Prospective
- Sector
- Advanced Electronics, Manufacturing (Industrial), Government
- Location
- Bhubaneswar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- Big News Network
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Project Information
Participants
Sponsoring Agency |
Status
Original status | approved |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | 3D Glass Solutions Inc. will establish an advanced packaging and embedded glass substrate semiconductor facility in Odisha's Info Valley, Bhubaneswar. |
Original sector | Technology |
Budget |
Location
Country | India |
State | Odisha |
City | Bhubaneswar |
Source
Source | Big News Network |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Manufacturing (Industrial), Government |
Article published date | 2025-08-14 |
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