3D Glass Solutions Inc. Advanced Packaging and Embedded Glass Substrate Unit
Sector: Manufacturing (Industrial) • Location: Bhubaneshwar, Odisha, India
Source: Big News Network
3D Glass Solutions Inc. is setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This facility will bring advanced packaging technology to India with technologies including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration modules. The planned capacity includes 69,600 glass panel substrates,
- Status
- Prospective
- Sector
- Manufacturing (Industrial), Automotive, Advanced Electronics
- Location
- Bhubaneshwar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- Big News Network
ConstructChat
Ask ConstructChat about 3D Glass Solutions Inc. Advanced Packaging and Embedded Glass Substrate Unit
Pick a question to edit it, or write your own.
First answer free · no account
Project Information FAQ
Project Information
Participants
| Not available for this record. |
Status
Original status | approved |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | 3D Glass Solutions Inc. is setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This facility will bring advanced packaging technology to India with technologies including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration modules. The planned capacity includes 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The products will have applications in defence, high-performance computing, AI, RF and automotive, photonics, and co-packaged optics. |
Original sector | Manufacturing |
Location
Country | India |
State | Odisha |
City | Bhubaneshwar |
Source
Source | Big News Network |
URL |
More Details
Record type | Project |
Sector | Manufacturing (Industrial), Automotive, Advanced Electronics |
Article published date | 2025-09-16 |
Research
Free account
View all details
You are reading the public part. A free account opens the rest:
- Every detail on this project
- News and media coverage
- Technical research
Free account · no card · lands you back on this project
