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3D Glass Solutions Inc. Advanced Packaging and Embedded Glass Substrate Unit

Sector: Manufacturing (Industrial) • Location: Bhubaneshwar, Odisha, India

Source: Big News Network

Project
Approved

3D Glass Solutions Inc. is setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This facility will bring advanced packaging technology to India with technologies including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration modules. The planned capacity includes 69,600 glass panel substrates,

Status
Prospective
Sector
Manufacturing (Industrial), Automotive, Advanced Electronics
Location
Bhubaneshwar, Odisha, India
Updated
22 Jul 2026
Source
Big News Network

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Project Information

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The project “3D Glass Solutions Inc. Advanced Packaging and Embedded Glass Substrate Unit” is an infrastructure initiative in the Manufacturing (Industrial) sector, located in Bhubaneshwar, Odisha, India. Taiyo aggregates data on it from Big News Network.

Participants

Not available for this record.

Status

Original status

approved

Taiyo status

Prospective

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

3D Glass Solutions Inc. is setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This facility will bring advanced packaging technology to India with technologies including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration modules. The planned capacity includes 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The products will have applications in defence, high-performance computing, AI, RF and automotive, photonics, and co-packaged optics.

Original sector

Manufacturing

Location

Country

India

State

Odisha

City

Bhubaneshwar

Source

Source

Big News Network

URL

More Details

Record type

Project

Sector

Manufacturing (Industrial), Automotive, Advanced Electronics

Article published date

2025-09-16

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