3D Glass Solutions Inc. Advanced Packaging and Embedded Glass Substrate Unit
Sector: Manufacturing (Industrial) • Location: Bhubaneshwar, Odisha, India
Source: Tribune India
3D Glass Solutions Inc. will set up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This unit will bring the world's most advanced packaging technology to India, including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration modules. The planned capacity is approximately 69,600 glass panel substrate
- Status
- Prospective
- Sector
- Manufacturing (Industrial), Automotive, Advanced Electronics
- Location
- Bhubaneshwar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- Tribune India
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Project Information
Participants
| Not available for this record. |
Status
Original status | approved |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | 3D Glass Solutions Inc. will set up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This unit will bring the world's most advanced packaging technology to India, including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration modules. The planned capacity is approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The products will have applications in defence, high-performance computing, AI, RF and automotive, photonics, and co-packaged optics. |
Original sector | Technology |
Location
Country | India |
State | Odisha |
City | Bhubaneshwar |
Source
Source | Tribune India |
URL |
More Details
Record type | Project |
Sector | Manufacturing (Industrial), Automotive, Advanced Electronics |
Article published date | 2025-09-16 |
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