3D Glass Solutions Inc. Advanced Packaging Facility
Sector: Manufacturing (Industrial) • Location: Bhubaneswar, Odisha, India
Source: Big News Network
3D Glass Solutions Inc. will establish an advanced packaging and embedded glass substrate facility in Odisha's Info Valley, Bhubaneswar. The facility will introduce advanced semiconductor packaging technology with an annual capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3D Heterogeneous Integration modules, used in high-performance computing, AI, defence electron
- Status
- Prospective
- Sector
- Manufacturing (Industrial), Advanced Electronics
- Location
- Bhubaneswar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- Big News Network
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Project Information
Participants
| Not available for this record. |
Status
Original status | approved |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | 3D Glass Solutions Inc. will establish an advanced packaging and embedded glass substrate facility in Odisha's Info Valley, Bhubaneswar. The facility will introduce advanced semiconductor packaging technology with an annual capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3D Heterogeneous Integration modules, used in high-performance computing, AI, defence electronics, radio frequency, and photonics applications. |
Original sector | Technology |
Budget |
Location
Country | India |
State | Odisha |
City | Bhubaneswar |
Source
Source | Big News Network |
URL |
More Details
Record type | Project |
Sector | Manufacturing (Industrial), Advanced Electronics |
Article published date | 2025-09-16 |
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