3D Glass Solutions Inc. Advanced Packaging Unit
Sector: Advanced Electronics • Location: Bhubaneshwar, Odisha, India
Source: Tribune India
3D Glass Solutions Inc. will set up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. The unit will bring advanced packaging technology to India with a planned capacity of approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3D Heterogeneous Integration modules per annum. The products will have applicat
- Status
- Prospective
- Sector
- Advanced Electronics, Automotive, Manufacturing (Industrial)
- Location
- Bhubaneshwar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- Tribune India
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Project Information
Participants
| Not available for this record. |
Status
Original status | approved |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | 3D Glass Solutions Inc. will set up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. The unit will bring advanced packaging technology to India with a planned capacity of approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3D Heterogeneous Integration modules per annum. The products will have applications in defence, high-performance computing, artificial intelligence, RF and automotive, photonics, and co-packaged optics. |
Original sector | Technology |
Location
Country | India |
State | Odisha |
City | Bhubaneshwar |
Source
Source | Tribune India |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Automotive, Manufacturing (Industrial) |
Article published date | 2025-08-14 |
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