3D Glass Solutions Inc. Glass Substrate Packaging Unit
Sector: Advanced Electronics • Location: Odisha, India
Source: NatStrat
A cutting-edge glass substrate packaging unit by 3D Glass Solutions Inc., approved under the India Semiconductor Mission, to support semiconductor packaging technologies.
- Status
- Prospective
- Sector
- Advanced Electronics, Manufacturing (Industrial), Government
- Location
- Odisha, India
- Updated
- 22 Jul 2026
- Source
- NatStrat
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Project Information
Participants
Sponsoring Agency |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | A cutting-edge glass substrate packaging unit by 3D Glass Solutions Inc., approved under the India Semiconductor Mission, to support semiconductor packaging technologies. |
Original sector | Technology & Economy |
Budget |
Location
Country | India |
State | Odisha |
Source
Source | NatStrat |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Manufacturing (Industrial), Government |
Article published date | 2025-11-27 |
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