3D Glass Solutions Packaging Unit by Heterogeneous Integration Packaging Solutions Pvt Ltd
Sector: Manufacturing (Industrial) • Location: Odisha, India
Source: The Economic Times
3D Glass Solutions' packaging unit by Heterogeneous Integration Packaging Solutions Pvt Ltd is the first project in India involving investment from Intel Corporation. The project is backed by US technology majors including Lockheed Martin and Applied Materials, with an investment of Rs 1,943 crore and an annual production capacity of 5 crore units. The ground-breaking ceremony was planned during I
- Status
- Prospective
- Sector
- Manufacturing (Industrial), Advanced Electronics
- Location
- Odisha, India
- Updated
- 22 Jul 2026
- Source
- The Economic Times
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Participants
| Not available for this record. |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
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Description
Description | 3D Glass Solutions' packaging unit by Heterogeneous Integration Packaging Solutions Pvt Ltd is the first project in India involving investment from Intel Corporation. The project is backed by US technology majors including Lockheed Martin and Applied Materials, with an investment of Rs 1,943 crore and an annual production capacity of 5 crore units. The ground-breaking ceremony was planned during Intel CEO Lip-Bu Tan's visit to India. |
Original sector | Technology |
Budget |
Location
Country | India |
State | Odisha |
Source
Source | The Economic Times |
URL |
More Details
Record type | Project |
Sector | Manufacturing (Industrial), Advanced Electronics |
Article published date | 2025-12-12 |
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