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3D Glass Solutions Semiconductor Packaging Facility

Sector: Aerospace & Defense • Location: Bhubaneswar, Odisha, India

Source: FoneArena.com

Project
Planned

3D Glass Solutions Inc. will establish a facility at Info Valley, Bhubaneswar, specializing in advanced semiconductor packaging and embedded glass substrates. The plant will produce 69,600 glass panels, 50 million units, and 13,200 3DHI modules annually for defense, AI, RF, automotive, and photonics applications.

Status
Prospective
Sector
Aerospace & Defense, Automotive, Advanced Electronics, Government
Location
Bhubaneswar, Odisha, India
Updated
22 Jul 2026
Source
FoneArena.com

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Project Information

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The project “3D Glass Solutions Semiconductor Packaging Facility” is an infrastructure initiative in the Aerospace & Defense sector, located in Bhubaneswar, Odisha, India. Taiyo aggregates data on it from FoneArena.com.

Participants

Sponsoring Agency

Status

Original status

planned

Taiyo status

Prospective

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

3D Glass Solutions Inc. will establish a facility at Info Valley, Bhubaneswar, specializing in advanced semiconductor packaging and embedded glass substrates. The plant will produce 69,600 glass panels, 50 million units, and 13,200 3DHI modules annually for defense, AI, RF, automotive, and photonics applications.

Original sector

Electronics

Budget

Location

Country

India

State

Odisha

City

Bhubaneswar

Source

Source

FoneArena.com

URL

More Details

Record type

Project

Sector

Aerospace & Defense, Automotive, Advanced Electronics, Government

Article published date

2025-09-16

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