3D Glass Solutions Semiconductor Packaging Unit
Sector: Aerospace & Defense • Location: Bhubaneswar, Odisha, India
Source: Bisinfotech
3D Glass Solutions Inc. will set up a state-of-the-art advanced packaging and embedded glass substrate facility in Odisha's Info Valley, Bhubaneswar. The facility will have an annual capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3D heterogeneous integration modules, serving defense, AI, high-performance computing, RF, automotive, and photonics sectors.
- Status
- Prospective
- Sector
- Aerospace & Defense, Advanced Electronics, Automotive, Government
- Location
- Bhubaneswar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- Bisinfotech
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Project Information
Participants
Sponsoring Agency |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | 3D Glass Solutions Inc. will set up a state-of-the-art advanced packaging and embedded glass substrate facility in Odisha's Info Valley, Bhubaneswar. The facility will have an annual capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3D heterogeneous integration modules, serving defense, AI, high-performance computing, RF, automotive, and photonics sectors. |
Original sector | Electronics |
Budget |
Location
Country | India |
State | Odisha |
City | Bhubaneswar |
Source
Source | Bisinfotech |
URL |
More Details
Record type | Project |
Sector | Aerospace & Defense, Advanced Electronics, Automotive, Government |
Article published date | 2025-08-14 |
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