What is the latest status of the project “3D Glass Solutions Semiconductor Unit in Odisha”?

The status recorded for “3D Glass Solutions Semiconductor Unit in Odisha” is planned.

What is the budget and commercial profile for the project “3D Glass Solutions Semiconductor Unit in Odisha”?

Taiyo normalizes the budget of “3D Glass Solutions Semiconductor Unit in Odisha” to USD 23749288.

Where can I verify the source and access all details for “3D Glass Solutions Semiconductor Unit in Odisha”?

This Taiyo project page references The Impressive Times along with the original URL (https://impressivetimes.com/latest/odisha-semiconductor-unit-ashwini-vaishnaw-bhubaneswar-chip-project/). Taiyo standardizes official data into a consistent, searchable project profile.

3D Glass Solutions Semiconductor Unit in Odisha

Sector: Advanced Electronics • Location: Bhubaneswar, Odisha, India

Source: The Impressive Times

Project

Planned

The project involves the establishment of a semiconductor unit in Bhubaneswar, Odisha, introducing advanced glass-based semiconductor packaging technology in India for the first time. It aims to support next-generation applications such as artificial intelligence, telecommunications, defence systems, and high-performance computing, with an investment of around Rs 1,943 crore and creation of approx

Status: Prospective
Sector: Advanced Electronics, Manufacturing (Industrial)
Location: Bhubaneswar, Odisha, India
Updated: 22 Jul 2026
Source: The Impressive Times

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Project Information

4 Q

The project “3D Glass Solutions Semiconductor Unit in Odisha” is an infrastructure initiative in the Advanced Electronics sector, located in Bhubaneswar, Odisha, India. Taiyo aggregates data on it from The Impressive Times.

Participants

Not available for this record.

Status

Original status	planned
Taiyo status	Prospective
Taiyo last update	2026-07-22

Contact

Not available for this record.

Description

Description	The project involves the establishment of a semiconductor unit in Bhubaneswar, Odisha, introducing advanced glass-based semiconductor packaging technology in India for the first time. It aims to support next-generation applications such as artificial intelligence, telecommunications, defence systems, and high-performance computing, with an investment of around Rs 1,943 crore and creation of approximately 2,500 jobs.
Original sector	Electronics and Information Technology
Budget

Location

Country	India
State	Odisha
City	Bhubaneswar

Source

Source	The Impressive Times
URL

More Details

Record type	Project
Sector	Advanced Electronics, Manufacturing (Industrial)
Article published date	2026-04-21

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3D Glass Solutions Semiconductor Unit in Odisha

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