3D JETPEP - REVOLUTIONIZING HIGH-VALUE MANUFACTURING WITH MULTI-AXIS JET PLASMA FINISHING

forthcoming

Imagine a world where the tedious, time-consuming, and error-prone process of manually finishing metal precision parts is a thing of the past. At plasmotion, we are making this vision a reality with our groundbreaking 3D JETPEP technology. This innovative solution combines plasma physics, electrochemistry, and fluid dynamics to automate the polishing, deburring, and cleaning of metal parts with unparalleled precision and efficiency. High-value manufacturing industries, such as semiconductor, medical, aerospace, and analytics, are plagued by the inefficiencies of manual finishing processes, which are labor-intensive, time-consuming, and prone to human error. The dependency on skilled labor is a crucial bottleneck in precision parts production, leading to delays, increased costs, and inconsistent quality. Our 3D JETPEP technology addresses these challenges by automating the surface finishing process using environmentally benign saltwater electrolytes. This makes us 15 times faster than laser polishing and suitable for serial production. The global market for precision parts was valued at 178,4 B€ in 2024 and is projected to reach 894,6 B€ by 2037, with Europe expected to lead the industry. Our competitive advantage lies in the unique combination of plasma-electrolytic processing and jet-based application, offering faster processing times, unmatched geometric fidelity, and environmental sustainability. Our business model includes machine sales, electrolyte sales, and after-sales services, creating a continuous revenue stream. To achieve our goals, we seek blended finance from the EIC Accelerator program – 2,5 M€ in grant funding to develop and validate our technology, and 3,23 M€ in equity funding to support deployment and scaling. With the support of EIC, we can de-risk our technology, attract private investment, and transform the surface finishing industry, creating a sustainable future for high-value manufacturing.