What is the latest status of the project “3D Semiconductor Packaging Unit”?

The status recorded for “3D Semiconductor Packaging Unit” is completed.

What is the budget and commercial profile for the project “3D Semiconductor Packaging Unit”?

Taiyo normalizes the budget of “3D Semiconductor Packaging Unit” to USD 244460000.

Where can I verify the source and access all details for “3D Semiconductor Packaging Unit”?

This Taiyo project page references USTHADIAN along with the original URL (https://www.usthadian.com/odisha-hosts-india-first-3d-semiconductor-packaging-unit/). Taiyo standardizes official data into a consistent, searchable project profile.

3D Semiconductor Packaging Unit

Sector: Advanced Electronics • Location: Bhubaneswar, Odisha, India

Source: USTHADIAN

Project

Completed

India's first 3D semiconductor packaging unit established in Info Valley, Odisha, focusing on advanced 3D packaging technology that stacks chip components vertically to enhance performance. The project supports sectors like AI, 5G, defense, and high-performance computing, aiming to boost India's self-reliance in semiconductor technology and strengthen the domestic electronics manufacturing ecosyst

Status: Closed
Sector: Advanced Electronics, Manufacturing (Industrial), Aerospace & Defense
Location: Bhubaneswar, Odisha, India
Updated: 22 Jul 2026
Source: USTHADIAN

ConstructChat

Ask ConstructChat about 3D Semiconductor Packaging Unit

Pick a question to edit it, or write your own.

First answer free · no account

I am a

Project Information

4 Q

The project “3D Semiconductor Packaging Unit” is an infrastructure initiative in the Advanced Electronics sector, located in Bhubaneswar, Odisha, India. Taiyo aggregates data on it from USTHADIAN.

Participants

Not available for this record.

Status

Original status	completed
Taiyo status	Closed
Taiyo last update	2026-07-22

Contact

Not available for this record.

Description

Description	India's first 3D semiconductor packaging unit established in Info Valley, Odisha, focusing on advanced 3D packaging technology that stacks chip components vertically to enhance performance. The project supports sectors like AI, 5G, defense, and high-performance computing, aiming to boost India's self-reliance in semiconductor technology and strengthen the domestic electronics manufacturing ecosystem.
Original sector	Electronics Manufacturing
Budget

Location

Country	India
State	Odisha
City	Bhubaneswar

Source

Source	USTHADIAN
URL

More Details

Record type	Project
Sector	Advanced Electronics, Manufacturing (Industrial), Aerospace & Defense
Article published date	2026-04-27

Research

Free account

View all details

You are reading the public part. A free account opens the rest:

Every detail on this project
News and media coverage
Technical research

View all details

Free account · no card · lands you back on this project

3D Semiconductor Packaging Unit

Ask ConstructChat about 3D Semiconductor Packaging Unit

Project Information FAQ

Project Information

Research

View all details

More Advanced Electronics projects in India