3DGS Advanced Packaging and Embedded Glass Substrate Facility
Sector: Advanced Electronics • Location: Bhubaneswar, Odisha, India
Source: The Times of India
3DGS is setting up a vertically integrated advanced packaging and embedded glass substrate facility at Info Valley in Bhubaneswar with a proposed investment of Rs 1,943 crore. The plant will bring advanced capabilities including glass interposers with integrated passives, silicon bridges, and 3D heterogeneous integration modules. This project follows Union cabinet approval in August last year and
- Status
- Prospective
- Sector
- Advanced Electronics, Manufacturing (Industrial)
- Location
- Bhubaneswar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- The Times of India
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Project Information
Participants
| Not available for this record. |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | 3DGS is setting up a vertically integrated advanced packaging and embedded glass substrate facility at Info Valley in Bhubaneswar with a proposed investment of Rs 1,943 crore. The plant will bring advanced capabilities including glass interposers with integrated passives, silicon bridges, and 3D heterogeneous integration modules. This project follows Union cabinet approval in August last year and complements India's semiconductor ecosystem development. |
Original sector | Technology |
Budget |
Location
Country | India |
State | Odisha |
City | Bhubaneswar |
Source
Source | The Times of India |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Manufacturing (Industrial) |
Article published date | 2026-06-01 |
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