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A revolutionary I/O Planning Solution for 2.5D & 3D Nanoelectronic Systems Design

Location: Italy

Source: EU Funding & Tenders Portal

Project
Ended

HIPER is an advanced EDA (Electronic Design Automation) software for the optimization of I/O Planning of 2.5-D micro/nano electronic systems. This is an important enabling technology to assist in the design of 2.5D electronics and has been developed by MONOZUKURI S.p.A. HIPER is capable of analysing, designing and optimizing the 2.5-D I/O planning of all electronic components (ICs, silicon interp

Status
Closed
Location
Italy
Updated
22 Jul 2026
Source
EU Funding & Tenders Portal

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The project “A revolutionary I/O Planning Solution for 2.5D & 3D Nanoelectronic Systems Design” is an infrastructure initiative, located in Italy. Taiyo aggregates data on it from EU Funding & Tenders Portal.

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Status

Original status

ended

Taiyo status

Closed

Taiyo last update

2026-07-22

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Description

Description

HIPER is an advanced EDA (Electronic Design Automation) software for the optimization of I/O Planning of 2.5-D micro/nano electronic systems. This is an important enabling technology to assist in the design of 2.5D electronics and has been developed by MONOZUKURI S.p.A. HIPER is capable of analysing, designing and optimizing the 2.5-D I/O planning of all electronic components (ICs, silicon interposer and package(s)) thanks to its software platform and revolutionary algorithms. This innovative solution will leverage a 30% reduction in the production costs, a 50% decrease in design lead-time, and an improvement in the overall product performance due to 65% reduction in wire crossing and 80% reduction in total connections length. The $7billion EDA market is dominated by three companies, Synopsys, Cadence Design Systems and Mentor Graphics. As a result of the work undertaken so far, in the 4th quarter of 2016 we started an official partnership with Synopsys where we have been granted access to their Physical implementation platform and we are currently working together to help two customers who are taping-out HBM-based 2.5D-IC. The solution, which is already backed by many prospective clients, targets major semiconductors companies, design houses, package manufacturers, and OSAT businesses, and is expected to be used by leading electronic companies in Europe (Italy, Germany, UK), ASIA, and USA within three years after its commercialization. The Global Electronic Design Automation market is expected to grow at a CAGR of 8.52% over the period 2016-2020 which provides an encouraging base for introducing new EDA tools. Moreover, HIPER perfectly serves the “Electronics Strategy for Europe”, adopted in May 2013 by the European Commission.

Location

Country

Italy

Source

Source

EU Funding & Tenders Portal

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Record type

Project

Article published date

2026-02-01

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