What is the latest status of the project “Advanced 3D Glass Semiconductor Packaging Unit”?

The status recorded for “Advanced 3D Glass Semiconductor Packaging Unit” is planned.

What is the budget and commercial profile for the project “Advanced 3D Glass Semiconductor Packaging Unit”?

Taiyo normalizes the budget of “Advanced 3D Glass Semiconductor Packaging Unit” to USD 237557660.

Where can I verify the source and access all details for “Advanced 3D Glass Semiconductor Packaging Unit”?

This Taiyo project page references GK Today along with the original URL (https://www.gktoday.in/odisha-signs-semiconductor-mou-with-intel-and-3dgs/). Taiyo standardizes official data into a consistent, searchable project profile.

Advanced 3D Glass Semiconductor Packaging Unit

Sector: Advanced Electronics • Location: Bhubaneswar, Odisha, India

Source: GK Today

Project

Planned

The project involves establishing India's first Advanced 3D Glass Semiconductor Packaging Unit at Info Valley in Bhubaneswar, Odisha. It focuses on semiconductor packaging and advanced glass-based integration to support high-density interconnections in heterogeneous integration and 3D packaging. The project is implemented by 3D Glass Solutions Inc. through its Indian subsidiary and aims to produce

Status: Prospective
Sector: Advanced Electronics, Government, Telecommunications
Location: Bhubaneswar, Odisha, India
Updated: 22 Jul 2026
Source: GK Today

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Project Information

4 Q

The project “Advanced 3D Glass Semiconductor Packaging Unit” is an infrastructure initiative in the Advanced Electronics sector, located in Bhubaneswar, Odisha, India. Taiyo aggregates data on it from GK Today.

Participants

Not available for this record.

Status

Original status	planned
Taiyo status	Prospective
Taiyo last update	2026-07-22

Contact

Not available for this record.

Description

Description	The project involves establishing India's first Advanced 3D Glass Semiconductor Packaging Unit at Info Valley in Bhubaneswar, Odisha. It focuses on semiconductor packaging and advanced glass-based integration to support high-density interconnections in heterogeneous integration and 3D packaging. The project is implemented by 3D Glass Solutions Inc. through its Indian subsidiary and aims to produce glass substrates, assembled units, and advanced 3D heterogeneous integration modules for applications in AI, high-performance computing, defence electronics, and next-generation telecom systems.
Original sector	Technology
Budget

Location

Country	India
State	Odisha
City	Bhubaneswar

Source

Source	GK Today
URL

More Details

Record type	Project
Sector	Advanced Electronics, Government, Telecommunications
Article published date	2026-06-01

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Advanced 3D Glass Semiconductor Packaging Unit

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