Advanced 3D Glass Semiconductor Packaging Unit
Sector: Aerospace & Defense • Location: Bhubaneswar, Odisha, India
Source: INVC NEWS
India's first Advanced 3D Glass Semiconductor Packaging Unit is being established in Bhubaneswar with backing from Intel. The facility will introduce glass substrate technology, enhancing chip performance, speed, and energy efficiency for advanced applications such as AI, defense, and high-performance computing. The project aims to strengthen India's position in the global semiconductor value chai
- Status
- Prospective
- Sector
- Aerospace & Defense, Advanced Electronics
- Location
- Bhubaneswar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- INVC NEWS
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Project Information
Participants
| Not available for this record. |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | India's first Advanced 3D Glass Semiconductor Packaging Unit is being established in Bhubaneswar with backing from Intel. The facility will introduce glass substrate technology, enhancing chip performance, speed, and energy efficiency for advanced applications such as AI, defense, and high-performance computing. The project aims to strengthen India's position in the global semiconductor value chain and reduce reliance on imported chips. |
Original sector | Technology |
Budget |
Location
Country | India |
State | Odisha |
City | Bhubaneswar |
Source
Source | INVC NEWS |
URL |
More Details
Record type | Project |
Sector | Aerospace & Defense, Advanced Electronics |
Article published date | 2026-04-21 |
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