Advanced 3D Semiconductor Packaging Facility in Odisha
Sector: Advanced Electronics • Location: Bhubaneswar, Odisha, India
Source: EE Times India
The project involves the establishment of India's first advanced 3D semiconductor packaging unit at Info Valley in Bhubaneswar, Odisha. It targets manufacturing products for AI, 5G, defence, and advanced electronics manufacturing. The facility is a greenfield, vertically integrated advanced packaging and embedded glass substrate assembly, test, marking, and packaging (ATMP) unit promoted by 3D Gla
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Participants
Sponsoring Agency | Obfuscated Data |
Company | Obfuscated Data |
Status
Original status | planned |
Taiyo status | Obfuscated Data |
Taiyo last update | 00-00-0000 |
Available timestamps | 00-00-0000 |
Available timestamp type | Obfuscated Data |
Contact
Contact name | Obfuscated Data |
Phone | 0000000000 |
ObfuscatedData@email.com | |
Address | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Description
Description | The project involves the establishment of India's first advanced 3D semiconductor packaging unit at Info Valley in Bhubaneswar, Odisha. It targets manufacturing products for AI, 5G, defence, and advanced electronics manufacturing. The facility is a greenfield, vertically integrated advanced packaging and embedded glass substrate assembly, test, marking, and packaging (ATMP) unit promoted by 3D Glass Solutions through its Indian subsidiary Heterogeneous Integration Packaging Solutions Pvt. Ltd. |
Original sub-sector | Obfuscated |
Original Currency | USD |
Original budget | 000000000000000 |
Procurement method | Obfuscated Data |
Budget | 000000000000000 |
Location
Region | Obfuscated |
Country | Obfuscated |
State | Obfuscated Data |
County | Obfuscated |
Location | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Source
Source reliability | High |
Data quality score | 100% |
Source | Obfuscated Data |
URL | obfuscated_data,obfuscateddata.com |
More Details
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Article Published Date | Obfuscated Data |