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Advanced Glass Substrate Semiconductor Packaging Unit

Sector: Geothermal • Location: Bhubaneswar, Odisha, India

Source: Business Standard

Project
Planned

The project involves establishing the country's first advanced glass substrate semiconductor packaging unit at Info Valley on the outskirts of Bhubaneswar, Odisha. It will manufacture advanced semiconductor packaging solutions based on glass substrates, enabling greater density, better thermal performance, faster signal transmission, and improved energy efficiency. The unit will have an annual pro

Status
Prospective
Sector
Geothermal, Advanced Electronics, Manufacturing (Industrial)
Location
Bhubaneswar, Odisha, India
Updated
22 Jul 2026
Source
Business Standard

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The project “Advanced Glass Substrate Semiconductor Packaging Unit” is an infrastructure initiative in the Geothermal sector, located in Bhubaneswar, Odisha, India. Taiyo aggregates data on it from Business Standard.

Participants

Not available for this record.

Status

Original status

planned

Taiyo status

Prospective

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

The project involves establishing the country's first advanced glass substrate semiconductor packaging unit at Info Valley on the outskirts of Bhubaneswar, Odisha. It will manufacture advanced semiconductor packaging solutions based on glass substrates, enabling greater density, better thermal performance, faster signal transmission, and improved energy efficiency. The unit will have an annual production capacity of 50 million assembled semiconductor units and is expected to generate nearly 2,500 direct and indirect employment opportunities.

Original sector

Semiconductor Manufacturing

Budget

Location

Country

India

State

Odisha

City

Bhubaneswar

Source

Source

Business Standard

URL

More Details

Record type

Project

Sector

Geothermal, Advanced Electronics, Manufacturing (Industrial)

Article published date

2026-04-21

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