Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line

ongoing

As a contribution to the EU Chips Act, the Research Fab Microelectronics Germany (FMD) proposes an Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line (APECS-PL), which combines the generation of globally competitive high technology that addresses the specific needs of German and European industry and enables a low-threshold, easily scalable industrial transfer. The APECS-PL will include novel characterization, quality assurance, testing & reliability methodologies, test methods to assess the security of microelectronic systems against physical attacks and a System Technology Co Optimization (STCO) framework. Together with the 2 nm GAA (imec), 5 nm FDSOI (Leti) and wide bandgap semiconductor pilot lines also planned within the EU Chips Act, the APECS-PL is also in a position to become an essential component on the way to the vision of a pan-European pilot line facility - and thus an indispensable pillar for achieving the EU Chips Act target of bringing 20% of the global supply of chip production back to Europe. In addition, APECS-PL offers a one-stop shop for a very broad international customer base in basically all classic vertical industrial sectors including large companies, SMEs and technology start-ups. Demonstrators are planned to evaluate how the elements of the pilot line work together. The FMD-OFC office, managed by Fraunhofer as legal entity, is responsible for operational management. As a first step for additional European R&D partners the project partners imec, Leti, VTT, IMB-CNM (CSIC), INL, Forth and TU Graz will be included. The shortage of skilled workers and scientists is of particular interest in the project. Better integration of a gender dimension into research and innovation content will be an essential part of the project. Systematic eco-design that generally minimizes energy and resource consumption is in line with the EU Green Deal.