Advanced Packaging Substrate Manufacturing Facility in Odisha
Sector: Advanced Electronics • Location: Bhubaneswar, Odisha, India
Source: INDIA New England News
The Odisha government has signed a memorandum of understanding with Intel and U.S.-based 3D Glass Solutions to set up an advanced packaging substrate manufacturing facility in Bhubaneswar, Khordha district. The facility will include cleanrooms, fabrication units, testing infrastructure, and research and development facilities, using advanced glass-based substrate technologies and high-density inte
- Status
- Prospective
- Sector
- Advanced Electronics, Government, Manufacturing (Industrial)
- Location
- Bhubaneswar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- INDIA New England News
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Project Information
Participants
| Not available for this record. |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | The Odisha government has signed a memorandum of understanding with Intel and U.S.-based 3D Glass Solutions to set up an advanced packaging substrate manufacturing facility in Bhubaneswar, Khordha district. The facility will include cleanrooms, fabrication units, testing infrastructure, and research and development facilities, using advanced glass-based substrate technologies and high-density interconnect packaging critical for AI, high-performance computing, telecommunications, and next-generation electronics. |
Original sector | Semiconductor |
Budget |
Location
Country | India |
State | Odisha |
City | Bhubaneswar |
Source
Source | INDIA New England News |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Government, Manufacturing (Industrial) |
Article published date | 2026-06-01 |
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