Advanced Packaging Substrate Manufacturing Facility in Odisha

planned

The Odisha government has signed a Memorandum of Understanding (MoU) with Intel and 3D Glass Solutions (3DGS) for establishing an Advanced Packaging Substrate Manufacturing Facility in Bhubaneswar, Odisha. This first-of-its-kind project in India will leverage advanced glass-based substrate technologies and high-density interconnect packaging, essential for sectors such as AI, high-performance computing, telecommunications, and next-generation electronics. The project will be implemented in phases and is expected to bring nearly $3.3 billion in foreign direct investment (FDI). It will house world-class cleanrooms, fabrication units, testing infrastructure, and R&D facilities, aiming to position Odisha as a leading semiconductor manufacturing hub and contribute to the state's economic growth targets.