Where can I verify the source and access all details for “Advanced Packaging Substrate Manufacturing Facility in Odisha”?

This Taiyo project page references The Hans India along with the original URL (https://www.thehansindia.com/amp/news/national/odisha-signs-33-billion-semiconductor-mou-with-intel-3dgs-1080790). Taiyo standardizes official data into a consistent, searchable project profile.

Advanced Packaging Substrate Manufacturing Facility in Odisha

Q: What is the latest status of the project “Advanced Packaging Substrate Manufacturing Facility in Odisha”?

The status recorded for “Advanced Packaging Substrate Manufacturing Facility in Odisha” is planned.

Q: What is the budget and commercial profile for the project “Advanced Packaging Substrate Manufacturing Facility in Odisha”?

Taiyo normalizes the budget of “Advanced Packaging Substrate Manufacturing Facility in Odisha” to USD 3300000000.

Sector: Advanced Electronics • Location: Bhubaneswar, Odisha, India

Source: The Hans India

Project

Planned

The Odisha government has signed a Memorandum of Understanding (MoU) with Intel and 3D Glass Solutions (3DGS) for establishing an Advanced Packaging Substrate Manufacturing Facility in Bhubaneswar, Odisha. The facility will use advanced glass-based substrate technologies and high-density interconnect packaging, supporting sectors like AI, high-performance computing, telecommunications, and next-ge

Status: Prospective
Sector: Advanced Electronics, Government, Commercial, Manufacturing (Industrial)
Location: Bhubaneswar, Odisha, India
Updated: 22 Jul 2026
Source: The Hans India

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Project Information

4 Q

The project “Advanced Packaging Substrate Manufacturing Facility in Odisha” is an infrastructure initiative in the Advanced Electronics sector, located in Bhubaneswar, Odisha, India. Taiyo aggregates data on it from The Hans India.

Participants

Not available for this record.

Status

Original status	planned
Taiyo status	Prospective
Taiyo last update	2026-07-22

Contact

Not available for this record.

Description

Description	The Odisha government has signed a Memorandum of Understanding (MoU) with Intel and 3D Glass Solutions (3DGS) for establishing an Advanced Packaging Substrate Manufacturing Facility in Bhubaneswar, Odisha. The facility will use advanced glass-based substrate technologies and high-density interconnect packaging, supporting sectors like AI, high-performance computing, telecommunications, and next-generation electronics. Intel will be the technology partner providing expertise, licensing, quality systems, and workforce capability building. The project aims to develop a semiconductor ecosystem, create high-skilled jobs, and strengthen Odisha's industrial base and economy.
Original sector	Electronics Manufacturing
Budget

Location

Country	India
State	Odisha
City	Bhubaneswar

Source

Source	The Hans India
URL

More Details

Record type	Project
Sector	Advanced Electronics, Government, Commercial, Manufacturing (Industrial)
Article published date	2026-06-01

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Advanced Packaging Substrate Manufacturing Facility in Odisha

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