Advanced System in Package Technologies Semiconductor Unit
Sector: Manufacturing (Industrial) • Location: Andhra Pradesh, India
Source: Ommcom News
Advanced System in Package Technologies (ASIP) will set up a semiconductor manufacturing unit in Andhra Pradesh under a technology tie-up with APACT Co. Ltd, South Korea. The unit will have an annual capacity of 96 million units. Manufactured products will be used in mobile phones, set-top boxes, automobile applications, and other electronic products.
- Status
- Prospective
- Sector
- Manufacturing (Industrial), Automotive, Advanced Electronics, Government
- Location
- Andhra Pradesh, India
- Updated
- 22 Jul 2026
- Source
- Ommcom News
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Project Information
Participants
Sponsoring Agency |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | Advanced System in Package Technologies (ASIP) will set up a semiconductor manufacturing unit in Andhra Pradesh under a technology tie-up with APACT Co. Ltd, South Korea. The unit will have an annual capacity of 96 million units. Manufactured products will be used in mobile phones, set-top boxes, automobile applications, and other electronic products. |
Original sector | Semiconductor Manufacturing |
Budget |
Location
Country | India |
State | Andhra Pradesh |
Source
Source | Ommcom News |
URL |
More Details
Record type | Project |
Sector | Manufacturing (Industrial), Automotive, Advanced Electronics, Government |
Article published date | 2025-09-16 |
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