What is the latest status of the project “ASIP Technologies OSAT and ATMP Facility”?

The status recorded for “ASIP Technologies OSAT and ATMP Facility” is groundbreaking ceremony scheduled.

What is the budget and commercial profile for the project “ASIP Technologies OSAT and ATMP Facility”?

Taiyo normalizes the budget of “ASIP Technologies OSAT and ATMP Facility” to USD 108784700.

Where can I verify the source and access all details for “ASIP Technologies OSAT and ATMP Facility”?

This Taiyo project page references The Economic Times along with the original URL (https://m.economictimes.com/tech/technology/taking-stock-of-indias-10-semiconductor-projects-under-ism-1-0/articleshow/129761164.cms). Taiyo standardizes official data into a consistent, searchable project profile.

ASIP Technologies OSAT and ATMP Facility

Sector: Advanced Electronics • Location: Visakhapatnam, Andhra Pradesh, India

Source: The Economic Times

Project

Groundbreaking Ceremony Scheduled

ASIP Technologies, in partnership with South Korean semiconductor firm APACT Limited, is establishing a high-tech OSAT and ATMP facility in Vizag. The project focuses on advanced packaging technologies including 2.5D and 3D packaging, bumping lines (8” and 12”), and multi-chip modules (MCM). The groundbreaking ceremony is scheduled for April 2026.

Status: Prospective
Sector: Advanced Electronics, Manufacturing (Industrial)
Location: Visakhapatnam, Andhra Pradesh, India
Updated: 22 Jul 2026
Source: The Economic Times

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Project Information

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The project “ASIP Technologies OSAT and ATMP Facility” is an infrastructure initiative in the Advanced Electronics sector, located in Visakhapatnam, Andhra Pradesh, India. Taiyo aggregates data on it from The Economic Times.

Participants

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Status

Original status	groundbreaking ceremony scheduled
Taiyo status	Prospective
Taiyo last update	2026-07-22

Contact

Not available for this record.

Description

Description	ASIP Technologies, in partnership with South Korean semiconductor firm APACT Limited, is establishing a high-tech OSAT and ATMP facility in Vizag. The project focuses on advanced packaging technologies including 2.5D and 3D packaging, bumping lines (8” and 12”), and multi-chip modules (MCM). The groundbreaking ceremony is scheduled for April 2026.
Original sector	Technology
Budget

Location

Country	India
State	Andhra Pradesh
City	Visakhapatnam

Source

Source	The Economic Times
URL

More Details

Record type	Project
Sector	Advanced Electronics, Manufacturing (Industrial)
Article published date	2026-03-26

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ASIP Technologies OSAT and ATMP Facility

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