ASIP Technologies Semiconductor Components Manufacturing Facility
Sector: Manufacturing (Industrial) • Location: Andhra Pradesh, India
Source: The Week
A semiconductor components manufacturing facility in Andhra Pradesh by Advanced System in Package (ASIP) Technologies in partnership with South Korean firm APACT Co Ltd. The facility will produce components for mobile phones, set-top boxes, automotive applications, and other electronics with an annual capacity of 96 million units.
Project Information FAQ
Project Information
Want to explore the full details? View the full report
Participants
Sponsoring Agency | Obfuscated Data |
Company | Obfuscated Data |
Status
Original status | planned |
Taiyo status | Obfuscated Data |
Taiyo last update | 00-00-0000 |
Available timestamps | 00-00-0000 |
Available timestamp type | Obfuscated Data |
Contact
Contact name | Obfuscated Data |
Phone | 0000000000 |
ObfuscatedData@email.com | |
Address | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Description
Description | A semiconductor components manufacturing facility in Andhra Pradesh by Advanced System in Package (ASIP) Technologies in partnership with South Korean firm APACT Co Ltd. The facility will produce components for mobile phones, set-top boxes, automotive applications, and other electronics with an annual capacity of 96 million units. |
Original sub-sector | Obfuscated |
Original Currency | USD |
Original budget | 000000000000000 |
Procurement method | Obfuscated Data |
Budget | 000000000000000 |
Location
Region | Obfuscated |
Country | Obfuscated |
State | Obfuscated Data |
County | Obfuscated |
Location | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Source
Source reliability | High |
Data quality score | 100% |
Source | Obfuscated Data |
URL | obfuscated_data,obfuscateddata.com |
More Details
Project Type | Obfuscated Data |
Article Published Date | Obfuscated Data |