ASIP Technologies Semiconductor Testing and Packaging Facility

Source: India Briefing

Project

Approved

ASIP Technologies, in partnership with South Korea’s APACT Co. Ltd., will build a semiconductor testing and packaging facility in Andhra Pradesh with an annual capacity of 96 million units to serve multiple electronics applications.

Project Information

5 Q

The project "ASIP Technologies Semiconductor Testing and Packaging Facility" is an infrastructure initiative in the Advanced Electronics, Manufacturing (Industrial) sector, located in N/A, India. Taiyo aggregates data from India Briefing, including information on sponsoring government bodies, EPCs, and contractors.

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Participants

Sponsoring Agency	Obfuscated Data
Company	Obfuscated Data

Status

Original status	approved
Taiyo status	Obfuscated Data
Taiyo last update	00-00-0000
Available timestamps	00-00-0000
Available timestamp type	Obfuscated Data

Contact

Contact name	Obfuscated Data
Phone	0000000000
Email	ObfuscatedData@email.com
Address	Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data

Description

Description	ASIP Technologies, in partnership with South Korea’s APACT Co. Ltd., will build a semiconductor testing and packaging facility in Andhra Pradesh with an annual capacity of 96 million units to serve multiple electronics applications.
Original sub-sector	Obfuscated
Original Currency	USD
Original budget	000000000000000
Procurement method	Obfuscated Data
Budget	000000000000000

Location

Region	Obfuscated
Country	Obfuscated
State	Obfuscated Data
County	Obfuscated
Location	Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data

Source

Source reliability	High
Data quality score	100%
Source	Obfuscated Data
URL	obfuscated_data,obfuscateddata.com

More Details

Project Type	Obfuscated Data
Article Published Date	Obfuscated Data

ASIP Technologies Semiconductor Testing and Packaging Facility

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