AT&S Malaysia

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The proposed investment is a sustainability linked loan (SLL) of up to US$400 million (or equivalent in Euros), including up to US$250 million (or equivalent in Euros) for IFC’s own account and up to US$150 million (or equivalent in Euros) in potential mobilization, to AT&S Austria Technologie & Systemtechnik (Malaysia) Sdn. Bhd. (“AT&S Malaysia” or the “Company”). AT&S Malaysia is a wholly owned subsidiary of AT&S Austria Technologie & Systemtechnik Aktiengesellschaft (“AT&S Austria”). AT&S Austria is a leading global manufacturer of high-end printed circuit boards (PCBs) and integrated circuit (IC) substrates. AT&S Malaysia was incorporated in June 2021 to house greenfield integrated circuit (IC) substrate manufacturing plant in Kulim, Malaysia for some of the key customers. IFC’s financing will be utilised to fund the capital expenditure and associated start-up costs / effects (i.e. the expenses until the commencement of mass production) for the first phase of this plant (the “Project”). AT&S Austria has a focus on sustainability and targets to reduce absolute Scope 1 and 2 GHG emissions by 38% by 2030/31 (compared to a baseline of 2021/22). The Project is aligned with the goals of the Paris Agreement.