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Breakthrough Integration and Resolution in Defect Repair

Sector: Commercial • Location: France

Source: EU Funding & Tenders Portal

Project
Ongoing

The BIRD European project (Bringing Intelligent Resolution to Defect-repair) aims to revolutionize the repair of defects in high-precision industries, such as display manufacturing and semiconductors. It will develop and integrate a groundbreaking additive manufacturing technology that enables nanometric-scale defect resolution, addressing critical issues like luminance inconsistencies and pixel m

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The project “Breakthrough Integration and Resolution in Defect Repair” is an infrastructure initiative in the Commercial sector, located in France. Taiyo aggregates data on it from EU Funding & Tenders Portal.

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ongoing

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Description

Description

The BIRD European project (Bringing Intelligent Resolution to Defect-repair) aims to revolutionize the repair of defects in high-precision industries, such as display manufacturing and semiconductors. It will develop and integrate a groundbreaking additive manufacturing technology that enables nanometric-scale defect resolution, addressing critical issues like luminance inconsistencies and pixel misalignments. This solution, called High Precision Capillary Printing (HPCaP), perfectly addresses the challenges encountered due to miniaturization and complexity at nanoscales, and even goes far beyond expectations. Not only does the process provide unparalleled high resolution (between 100 nm and 50 microns), but it also enables the deposition of any liquid material on any surface with a high degree of design freedom. The company's flagship product, the NAZCA prototyping tool, has reached TRL 8 and has been sold to leading clients in Europe, the U.S., and Asia. The next step involves scaling this innovation to create a commercial-grade repair module designed for seamless integration into display and semiconductor industries production lines. This HPCaP module will address a serviceable obtainable market (SOM) estimated at over €91M by 2028. By partnering with top European research institutions and industry players, BIRD will ensure the validation and scalability of this innovative technology, targeting high-yield, defect-free production. As the display and semiconductor industries face increasing demand for precision manufacturing, Hummink’s solutions provide a timely response to growing concerns over waste and yield losses. This project supports the objectives of the European Green Deal by promoting sustainable, resource-efficient manufacturing, reducing waste, and contributing to Europe’s technological sovereignty. Through this, BIRD will significantly enhance the competitiveness of European industries in high-volume manufacturing and semiconductor repair markets.

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100%

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