Broadcom Semiconductor Assembly, Test, and Packaging Facility in Spain
Sector: Advanced Electronics • Location: Spain
Source: digitimes
Broadcom planned to invest US$1 billion in an assembly, test, and packaging (ATP) semiconductor facility in Spain. The project was intended to boost Southern Europe's semiconductor industry but was reportedly canceled due to failure to reach an agreement with the Spanish government.
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Participants
Sponsoring Agency | Obfuscated Data |
Company | Obfuscated Data |
Status
Original status | cancelled |
Taiyo status | Obfuscated Data |
Taiyo last update | 00-00-0000 |
Available timestamps | 00-00-0000 |
Available timestamp type | Obfuscated Data |
Contact
Contact name | Obfuscated Data |
Phone | 0000000000 |
ObfuscatedData@email.com | |
Address | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Description
Description | Broadcom planned to invest US$1 billion in an assembly, test, and packaging (ATP) semiconductor facility in Spain. The project was intended to boost Southern Europe's semiconductor industry but was reportedly canceled due to failure to reach an agreement with the Spanish government. |
Original sub-sector | Obfuscated |
Original Currency | USD |
Original budget | 000000000000000 |
Procurement method | Obfuscated Data |
Budget | 000000000000000 |
Location
Region | Obfuscated |
Country | Obfuscated |
State | Obfuscated Data |
County | Obfuscated |
Location | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Source
Source reliability | High |
Data quality score | 100% |
Source | Obfuscated Data |
URL | obfuscated_data,obfuscateddata.com |
More Details
Project Type | Obfuscated Data |
Article Published Date | Obfuscated Data |