CHIPS National Advanced Packaging Manufacturing Program
Sector: Advanced Electronics • Location: Tempe, Arizona, United States
Source: U.S. Department of Commerce
The CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to enhance U.S. leadership in advanced semiconductor packaging. This initiative aims to establish a self-sustaining domestic advanced packaging industry, facilitating the manufacturing and packaging of advanced node chips in the U.S.
- Status
- Closed
- Sector
- Advanced Electronics, Manufacturing (Industrial), Government
- Location
- Tempe, Arizona, United States of America
- Updated
- 22 Jul 2026
- Source
- U.S. Department of Commerce
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Project Information
Participants
Sponsoring Agency |
Status
Original status | Awarded |
Taiyo status | Closed |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | The CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to enhance U.S. leadership in advanced semiconductor packaging. This initiative aims to establish a self-sustaining domestic advanced packaging industry, facilitating the manufacturing and packaging of advanced node chips in the U.S. |
Original sector | Semiconductors |
Budget |
Location
Country | United States of America (USA) |
State | Arizona |
City | Tempe |
Source
Source | U.S. Department of Commerce |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Manufacturing (Industrial), Government |
Article published date | 2025-03-20 |
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