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CHIPS National Advanced Packaging Manufacturing Program

Sector: Advanced Electronics • Location: Tempe, Arizona, United States

Source: U.S. Department of Commerce

Project
Awarded

The CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to enhance U.S. leadership in advanced semiconductor packaging. This initiative aims to establish a self-sustaining domestic advanced packaging industry, facilitating the manufacturing and packaging of advanced node chips in the U.S.

Status
Closed
Sector
Advanced Electronics, Manufacturing (Industrial), Government
Location
Tempe, Arizona, United States of America
Updated
22 Jul 2026
Source
U.S. Department of Commerce

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Project Information

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The project “CHIPS National Advanced Packaging Manufacturing Program” is an infrastructure initiative in the Advanced Electronics sector, located in Tempe, Arizona, United States. Taiyo aggregates data on it from U.S. Department of Commerce.

Participants

Sponsoring Agency

Status

Original status

Awarded

Taiyo status

Closed

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

The CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to enhance U.S. leadership in advanced semiconductor packaging. This initiative aims to establish a self-sustaining domestic advanced packaging industry, facilitating the manufacturing and packaging of advanced node chips in the U.S.

Original sector

Semiconductors

Budget

Location

Country

United States of America (USA)

State

Arizona

City

Tempe

Source

Source

U.S. Department of Commerce

URL

More Details

Record type

Project

Sector

Advanced Electronics, Manufacturing (Industrial), Government

Article published date

2025-03-20

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