Copper Cold Plates for Data Center Cooling
Sector: Metal • Location: Urbana-Champaign, Illinois, USA
Source: EurekAlert!
Mechanical engineers designed pure copper cold plates using topology optimization and electrochemical additive manufacturing to improve cooling efficiency of computer chips. These cold plates outperform conventional ones and significantly reduce energy usage in data centers by enabling more efficient liquid cooling compared to traditional air-cooling methods.
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Participants
Sponsoring Agency | Obfuscated Data |
Company | Obfuscated Data |
Status
Original status | developed and tested |
Taiyo status | Obfuscated Data |
Taiyo last update | 00-00-0000 |
Available timestamps | 00-00-0000 |
Available timestamp type | Obfuscated Data |
Contact
Contact name | Obfuscated Data |
Phone | 0000000000 |
ObfuscatedData@email.com | |
Address | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Description
Description | Mechanical engineers designed pure copper cold plates using topology optimization and electrochemical additive manufacturing to improve cooling efficiency of computer chips. These cold plates outperform conventional ones and significantly reduce energy usage in data centers by enabling more efficient liquid cooling compared to traditional air-cooling methods. |
Original sub-sector | Obfuscated |
Original Currency | USD |
Original budget | 000000000000000 |
Procurement method | Obfuscated Data |
Budget | 000000000000000 |
Location
Region | Obfuscated |
Country | Obfuscated |
State | Obfuscated Data |
County | Obfuscated |
Location | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Source
Source reliability | High |
Data quality score | 100% |
Source | Obfuscated Data |
URL | obfuscated_data,obfuscateddata.com |
More Details
Project Type | Obfuscated Data |
Article Published Date | Obfuscated Data |