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Electronics Resurgence Initiative: Page 3 Materials and Integration

Sector: Manufacturing (Industrial) • Location: United States of America

Source: Grants.gov

Project
Archived

Amendment 01: The purpose of this amendment is to make administrative changes as highlighted in yellow in the attached.

Original Synopsis Below: The overall goal of the Three Dimensional Monolithic System-on-a-Chip (3DSoC) program is to develop 3D monolithic technology that will enable > 50X improvement in SOC digital performance at power. 3DSOC aims to drive research in process, design tools

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The project “Electronics Resurgence Initiative: Page 3 Materials and Integration” is an infrastructure initiative in the Manufacturing (Industrial) sector, located in United States of America. Taiyo aggregates data on it from Grants.gov.

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archived

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Description

Description

Amendment 01: The purpose of this amendment is to make administrative changes as highlighted in yellow in the attached. Original Synopsis Below: The overall goal of the Three Dimensional Monolithic System-on-a-Chip (3DSoC) program is to develop 3D monolithic technology that will enable > 50X improvement in SOC digital performance at power. 3DSOC aims to drive research in process, design tools, and new compute architectures for future designs while utilizing U.S. fabrication capabilities. The goal of the Foundations Required for Novel Compute (FRANC) program is to define the foundations required for assessing and establishing the proof of principle for beyond von Neumann compute architectures. FRANC will seek to demonstrate prototypes that quantify the benefits of such new computing architectures.

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High

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100%

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