ESMC 300-mm Wafer Fab in Dresden
Sector: Advanced Electronics • Location: Dresden, Germany
Source: EE Times Europe
ESMC, a joint venture among TSMC, NXP Semiconductors, Infineon Technologies, and Robert Bosch, is pursuing construction of a €10 billion 300-mm wafer fab in Dresden, Germany.
- Status
- Prospective
- Sector
- Advanced Electronics, Manufacturing (Industrial), Warehouse
- Location
- Dresden, Germany
- Updated
- 22 Jul 2026
- Source
- EE Times Europe
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Project Information
Participants
| Not available for this record. |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | ESMC, a joint venture among TSMC, NXP Semiconductors, Infineon Technologies, and Robert Bosch, is pursuing construction of a €10 billion 300-mm wafer fab in Dresden, Germany. |
Original sector | Semiconductor Manufacturing |
Location
Country | Germany |
City | Dresden |
Source
Source | EE Times Europe |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Manufacturing (Industrial), Warehouse |
Article published date | 2025-12-05 |
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