Functional Improvement & Validation of next Generation Equipment - Pulsed Laser Deposition for High Volume Manufacturing of enhanced piezo thin film materials enabling 5G data communication

ended

The next generation of mobile technology, known as 5G, offers enormous potential for businesses and the wider public as it will facilitate faster downloads, reduce latency and improve energy efficiency – crucial attributes to achieving the Internet of Things (IoT) and the use of mobile networks to connect and operate autonomous cars, remotely controlled industrial robots, telehealth systems, and smart city infrastructure. However, the technology and ability to manufacture the components that are crucial to 5Gs success are currently not at a level where this potential can become a reality at a cost that would make its widespread roll out viable. Without urgent investment in 5G component manufacturing Europe seriously risks being left behind and allowing the US and Asia to take the lead in this crucial technology. The Solmates team has taken their PLD technology from initial concept to commercial equipment installed at institutes such as Imec, EPFL and Sintef i.e. for low volume production and R&D uses. The processes that run on the equipment currently are positioned at TRL 6. Funding is required to further develop Solmates’ PLD equipment and processes and ensure they are ready for entering the 200mm 5G component market. The FIVE-G project will therefore focus on four objectives to bring PLD into high volume manufacturing: 1. Establish requirements of manufacturers and develop the technology to meet these. 2. Reduce particle inclusion to the level required for the identified 5G applications 3. Adapt Solmates' PLD to cluster manufacturing. 4. Establish a distribution agreement and prepare for launch The introduction of high volume manufacturing PLD will advance the market, by providing more reliable deposition that is able to meet the technical needs of a future 5G network at a cost and throughput that is truly market leading.