Heterogeneous Integration Packaging Solutions (3D Glass Solutions)
Sector: Aerospace & Defense • Location: Bhubaneswar, Odisha, India
Source: Pragativadi
India's first advanced 3D chip packaging unit using glass substrate-based advanced semiconductor packaging technology. The project aims to produce 50 million assembled units annually and generate around 2,500 jobs, serving sectors like aerospace, defence, AI, 5G, and data centres.
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Participants
Sponsoring Agency | Obfuscated Data |
Company | Obfuscated Data |
Status
Original status | planned |
Taiyo status | Obfuscated Data |
Taiyo last update | 00-00-0000 |
Available timestamps | 00-00-0000 |
Available timestamp type | Obfuscated Data |
Contact
Contact name | Obfuscated Data |
Phone | 0000000000 |
ObfuscatedData@email.com | |
Address | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Description
Description | India's first advanced 3D chip packaging unit using glass substrate-based advanced semiconductor packaging technology. The project aims to produce 50 million assembled units annually and generate around 2,500 jobs, serving sectors like aerospace, defence, AI, 5G, and data centres. |
Original sub-sector | Obfuscated |
Original Currency | USD |
Original budget | 000000000000000 |
Procurement method | Obfuscated Data |
Budget | 000000000000000 |
Location
Region | Obfuscated |
Country | Obfuscated |
State | Obfuscated Data |
County | Obfuscated |
Location | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Source
Source reliability | High |
Data quality score | 100% |
Source | Obfuscated Data |
URL | obfuscated_data,obfuscateddata.com |
More Details
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