Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) Program
Sector: Aerospace & Defense • Location: Arlington, Virginia, United States
Source: Military Aerospace
The HAPPI program aims to develop 3D chip-to-chip and intra-chip photonic interconnects to enhance military information throughput and reduce vulnerability to electromagnetic interference. The project focuses on high-density optical links and robust optical interfaces for integrated circuits.
- Status
- Prospective
- Sector
- Aerospace & Defense
- Location
- Arlington, Virginia, United States of America
- Updated
- 22 Jul 2026
- Source
- Military Aerospace
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Project Information
Participants
| Not available for this record. |
Status
Original status | Planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | The HAPPI program aims to develop 3D chip-to-chip and intra-chip photonic interconnects to enhance military information throughput and reduce vulnerability to electromagnetic interference. The project focuses on high-density optical links and robust optical interfaces for integrated circuits. |
Original sector | Photonics |
Budget |
Location
Country | United States of America (USA) |
State | Virginia |
City | Arlington |
Source
Source | Military Aerospace |
URL |
More Details
Record type | Project |
Sector | Aerospace & Defense |
Article published date | 2025-04-24 |
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