Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) Program
Sector: Manufacturing (Industrial) • Location: Arlington, Virginia, United States
Source: Military Aerospace
IBM, along with other organizations, is developing 3D chip-to-chip and intra-chip photonic interconnects to enhance military information throughput and reduce electromagnetic interference. The project focuses on creating low-loss, high-density optical interconnects for 3D chips using scalable manufacturing processes compatible with microelectronics.
- Status
- Prospective
- Sector
- Manufacturing (Industrial), Aerospace & Defense
- Location
- Arlington, Virginia, United States of America
- Updated
- 22 Jul 2026
- Source
- Military Aerospace
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Project Information
Participants
| Not available for this record. |
Status
Original status | Planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | IBM, along with other organizations, is developing 3D chip-to-chip and intra-chip photonic interconnects to enhance military information throughput and reduce electromagnetic interference. The project focuses on creating low-loss, high-density optical interconnects for 3D chips using scalable manufacturing processes compatible with microelectronics. |
Original sector | Military |
Budget |
Location
Country | United States of America (USA) |
State | Virginia |
City | Arlington |
Source
Source | Military Aerospace |
URL |
More Details
Record type | Project |
Sector | Manufacturing (Industrial), Aerospace & Defense |
Article published date | 2025-04-25 |
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